TSMC plans another $100B US investment - geopolitical insurance at semiconductor scale
TSMC is accepting a 30-50% cost premium on US manufacturing. That's not a business decision—it's a geopolitical hedge at foundry scale.
25 min ago 6 6
TSMC is accepting a 30-50% cost premium on US manufacturing. That's not a business decision—it's a geopolitical hedge at foundry scale.
25 min ago 6 6
Japanese companies are collectively upgrading earnings guidance as global AI capital expenditure flows through the upstream supply chain—semiconductors, manufacturing equipment, and materials.
yesterday 9 9
A startup is using AI to explore the space of possible semiconductor and cooling materials. At 1,000W per chip, thermal management is becoming the limiting factor for datacenter density.
Aug 10, 2026 at 16:30 10 11
SK Hynix is considering bringing in an outside investor for its $3 billion China DRAM facility. The move signals a new phase in the memory chip geopolitical chess game—neither a full exit nor full commitment.
Aug 8, 2026 at 09:57 14 16
Taiwan's Nanya Technology plans a $10.7 billion fab investment, adding another major player to a global DRAM expansion wave driven entirely by AI memory demand.
Aug 7, 2026 at 10:55 13 13
Apple's reported negotiations with CXMT - China's state-backed DRAM manufacturer - have stalled on pricing. Supply diversification from Samsung and Micron is proving more politically and commercially complex than expected.
Aug 6, 2026 at 11:00 11 11
South Korean startup DeepX raises $30M for its AI chip dedicated to edge inference. Following datacenter GPUs, Korea bets on a specialized chip for on-device deployments—free from Nvidia dependency.
Aug 4, 2026 at 12:01 10 11
Korean industry data show conventional (non-HBM) memory prices at all-time highs in July—the AI supercycle now spills into the general-purpose stack.
Aug 3, 2026 at 13:20 11 13
ChangXin Memory Technologies nears mass production of 12,800 Mbps LPDDR6 mobile DRAM—a real technological leap for China's memory industry, months after its IPO surge.
Aug 1, 2026 at 09:40 15 13
Samsung plans to build the base die of HBM5 using its 2nm process, aiming for a 50% speed improvement. Memory is no longer just about increasing capacity; it's also about leveraging advanced logic-node economics.
Jul 27, 2026 at 10:16 17 12
Nvidia signs $1.5B with Amkor for advanced packaging in the United States. The compute AI bottleneck rises one notch towards the sovereignty of the back-end.
Jul 26, 2026 at 18:40 8 9
Three days of meetings in Seoul and San Francisco result in a Korea-US package valued by ETNews at ~$950B. The `korea-ai-supercycle` thread moves from signal to lock.
Jul 26, 2026 at 18:40 14 11