Conventional DRAM and NAND hit record highs in July: the memory squeeze widens
Korean industry data show conventional (non-HBM) memory prices at all-time highs in July—the AI supercycle now spills into the general-purpose stack.
6 h ago 6 8
MediaTek commits $5B: the Taiwanese fabless giant enters the AI capex league
The board approves a significant AI-focused budget—first custom AI chip expected in Q4 2026, a second in 2028.
yesterday 12 13
Montage starts CXL 3.2 chip production - China gets a second memory-fabric supplier
Shanghai's Montage begins production of CXL 3.2 controllers - the memory-pooling fabric that reshapes AI-server economics gets a second Chinese supplier.
Aug 1, 2026 at 09:40 14 18
CXMT closes in on LPDDR6 mass production at 12,800 Mbps - the Chinese memory step-up
ChangXin Memory Technologies nears mass production of 12,800 Mbps LPDDR6 mobile DRAM—a real technological leap for China's memory industry, months after its IPO surge.
Aug 1, 2026 at 09:40 12 13
China Telecom deploys the first domestic TPU cluster - Zhonghao Xinying brings silicon to service
China Telecom deploys the first TPU cluster in Hangzhou based on Zhonghao Xinying's Chana chips. The Chinese sovereign compute gains a third silicon vendor with a scale customer.
Jul 28, 2026 at 21:00 17 12
Verizon locks $1B of dark fiber for Google - the DC bottleneck spreads to the backhaul
Verizon signs $1 billion of dark fiber dedicated to Google data centers, presented as "the first of many". After the chip, electronics, and water, long-distance optical capacity becomes the next AI bottleneck.
Jul 28, 2026 at 21:00 9 9
Samsung pushes HBM5 base die to 2nm targeting +50% speed - the memory war moves to logic-class nodes
Samsung plans to build the base die of HBM5 using its 2nm process, aiming for a 50% speed improvement. Memory is no longer just about increasing capacity; it's also about leveraging advanced logic-node economics.
Jul 27, 2026 at 10:16 14 12
Nvidia's $1.5B Amkor deal: the US packaging leg finally gets its capex
Nvidia signs $1.5B with Amkor for advanced packaging in the United States. The compute AI bottleneck rises one notch towards the sovereignty of the back-end.
Jul 26, 2026 at 18:40 8 9
Korea-US $950B: the AI supercycle signs its most political contract yet
Three days of meetings in Seoul and San Francisco result in a Korea-US package valued by ETNews at ~$950B. The `korea-ai-supercycle` thread moves from signal to lock.
Jul 26, 2026 at 18:40 14 11
Nvidia signs $1.5B with Amkor: US advanced packaging becomes an AI compute hub
Nvidia commits $1.5 billion with Amkor for advanced AI chip packaging in Peoria (Arizona). One of the first public commitments of this size for a back-end located outside the TSMC / ASE Taiwan duo.
Jul 24, 2026 at 21:02 10 10
Alibaba Cloud deploys Qwen3.8 on Zhenwu chip: silicon substitution becomes operational
A state-of-the-art Qwen model served on domestic silicon - the message is more strategic than technical.
Jul 24, 2026 at 09:34 11 11
Sequoia leads $300M into Etched: the ASIC transformer is back in the spotlight
Etched is making a narrow bet - a dedicated ASIC for Transformers - as Nvidia's roadmap hardens on pricing. Sequoia is putting $300M to validate the thesis.
Jul 24, 2026 at 09:33 9 8