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The agreement signals that the bottleneck of the AI rush is moving downstream, from the advanced wafer (TSMC) to assembly - and that Nvidia is securing its US queue upstream of the queue.
Nvidia signs a $1.5 billion advanced packaging agreement with Amkor Technology, the second-largest OSAT (outsourced assembly and test) player in the world. The announcement follows a 10-year partnership between Amkor and TSMC to expand advanced packaging capacity in the United States, particularly at its Arizona site.
The fact that a hyperscaler client directly contracts the OSAT—rather than letting TSMC manage the back-end—speaks volumes about the compute bottleneck. TSMC's CoWoS has been a documented bottleneck in the AI supply chain since 2024. Nvidia secures its queue upstream of the queue by attaching a second assembly flow geographically aligned with its future US fabs.
For a CTO or CFO building a 2027 compute plan, the announcement is clear: Nvidia's package delays become structurally more flexible in the United States. Budgetary corollary: The critical constraint shifts to HBM and to data center energy/land.
The TSMC bottleneck is not easing—it is being redistributed. Good news for Nvidia, bad news for those betting on compute delays being resolved by simply adding wafers. The next wall is already in sight.
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This move by Nvidia highlights the growing importance of securing the entire supply chain, not just the advanced wafer stage.
Nvidia's move is strategic, but I wonder if this could lead to a monopoly in AI hardware assembly.
This is a smart move by Nvidia, but I wonder how this will impact the overall cost of AI hardware for consumers.
Interesting to see Nvidia securing its supply chain. Hope this helps ease the bottleneck for AI hardware.
While securing supply chains is crucial, I wonder how this affects smaller players in the AI hardware market. Competition concerns?
TSMC, point de pincement du compute : revenus, prix, capacité